IDT (Integrated Device Technology) 71V632S6PFI8 Mfr Package Description: 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 Technology: CMOS Package Shape: RECTANGULAR Package Style: FLATPACK, LOW PROFILE Surface Mount: Yes Terminal Form: GULL WING Terminal Pitch: 0.6500 mm Terminal Finish: TIN LEAD Terminal Position: QUAD Number of Functions: 1 Number of Terminals: 100 Package Body Material: PLASTIC/EPOXY Temperature Grade: INDUSTRIAL Memory Width: 32 Organization: 64K X 32 Memory Density: 2.10E6 deg Operating Mode: SYNCHRONOUS Number of Words: 65536 words Number of Words Code: 64K Operating Temperature-Max: 85 Cel Operating Temperature-Min: -40 Cel Supply Voltage-Max (Vsup): 3.63 V Supply Voltage-Min (Vsup): 3.14 V Supply Voltage-Nom (Vsup): 3.3 V Memory IC Type: CACHE SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 6 ns